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 Memory ICs
8k x 8 Bit SRAM
BR6265BF-N10SL
The BR6265BF-N10SL is an 8192 word x 8 bit CMOS static RAM. It runs on a 5V single power supply, and input can be directed coupled with TTL. Current dissipation in the non-selected state is extremely low at 20A (max.), and memory information can be retained even at a low voltage of 2V, making this product ideal for battery backup operations. Both the access and cycle timing are 100ns, facilitating timing design.
*Applications General-purpose *Featureswith an 8192 x 8 bit configuration. 1) SRAM
2) 5V single power supply voltage with 10% fluctuation tolerance. 3) High speed access time of 100ns. 4) TTL compatible input / output. 5) Input and output use the same pin, and there are 3 output states. 6) No clock is necessary (asynchronous static circuit). 7) Input and output data are in the same phase. 8) Low power dissipation.
*Block diagram
A8 A5 A6 A7 A12 A9 A11 I / O0 INPUT DATA CONTROL I / O7 ROW ROW ADDRESS DECORDER BUFFER 65536BIT (128 x 512) MEMORY CELL ARRAY
COLUMN SWITCH COLUMN DECODER
OUTPUT DATA CONTROL
COLUMN ADDRESS BUFFER A0 A1 A2 A3 A4 A10
CE1 CE2 OE WE
CONTROL BUFFER
1
Memory ICs
BR6265BF-N10SL
*Absolute maximum ratings (Ta = 25C)
Parameter Power supply voltage Power dissipation Operating temperature Storage temperature I / O voltage Symbol VCC Pd Topr Tstg VI Limits - 0.51 ~ + 7.0 8502 0 ~ 70 - 55 ~ + 125 - 0.5 ~ VCC + 0.5 Unit V mW C C V
1 At pulse width of 50 ns : - 3.0V (min.)
2 Reduced by 8.5mW for each increase in Ta of 1C over 25C.
*Recommended operating conditions (Ta = 25C)
Parameter Power supply voltage Input high level voltage Input low level voltage Ambient temperature Symbol VCC VIH VIL Ta Min. 4.5 2.2 - 0.3 0 Typ. 5.0 -- -- -- Max. 5.5 VCC + 0.5 0.8 70 Unit V V V C
*Pin descriptions
Pin No. 1 2 ~ 10, 21, 23 ~ 25 11 ~ 13, 15 ~ 19 20 26 22 27 28 14 Pin name NC A0 ~ A12 I / O0 ~ I / O7 CE1 CE2 OE WE VCC VSS Internal chip and not connected 8192-byte memory address input 8-bit data I / O Chip enable control input Chip enable control input Output enable control input Write enable control input 5V 10%power supply Reference voltage for all input / output, 0V Function
2
Memory ICs
BR6265BF-N10SL
*Electrical characteristics (unless otherwise noted, Ta = 0 to 70C, VCC = 5V 10%)
Parameter Input low level voltage Input high level voltage Output low level voltage Output high level voltage Input leakage current Output leakage current Symbol VIL VIH VOL VOH ILI ILO ICCA1 Average operating current ICCA2 ISB Standby current ISB1 ISB2 -- -- -- -- -- -- -- -- 10 3 20 20 mA mA A A Min. - 0.31 2.2 0 2.4 VCC x 0.8 -- -- -- Typ. -- -- -- -- -- -- -- -- Max. 0.8 VCC + 0.5 0.4 VCC VCC 1 1 40 Unit V V V V V A A mA IOL = 2.1mA IOH = - 1.0mA IOH = - 0.1mA VIN = 0 ~ VCC VOUT = 0 ~ VCC CE1 = VIL, CE2 = VIH, I / O: OPEN Minimum cycle time CE1 = VIL, CE2 = VIH, I / O: OPEN f = 1MHz CE1 = VIH or CE2 = VIL CE1 CE2 CE2 VCC - 0.2V, VCC - 0.2V or CE2 0.2V 0.2V Conditions -- -- Measurement circuit -- -- Fig.1 Fig.2 -- Fig.3 Fig.4 Fig.5 Fig.5 -- Fig.6 --
1 At input voltage pulse width of 50 ns or less : - 3.0V
3
Memory ICs
BR6265BF-N10SL
*Measurement circuits
VCC VCC VCC VCC I / O0 ~ I / O7 VSS VSS V VOL V VOH 2.1mA I / O0 ~ I / O7 1.0mA
Data sets all output to LOW (Data 00)
Data sets all output to HIGH (Data FF)
Fig. 1 Output low level voltage measurement circuit
Fig. 2 Output high level voltage measurement circuit
VCC VCC
VCC
IL1 A
VCC A0 ~ A12 CE1, CE2 VSS
VCC OE I / O0 ~ I / O7 VSS
ILO A
VIN
= 0 ~ VCC
VOUT
= 0 ~ VCC
Fig. 3 Input leakage measurement circuit
Fig. 4 Output leakage current measurement circuit
VCC
VCC
VIH
A
ICCA1, ICCA2 VIH
A
ISB, 1
WE CE2 CE1 OE
VCC I / O0 ~ I / O7 SW
OPEN
q
VCC VIL or VIH
(Min. cycle)
CE1 CE2
I / O0 ~ I / O7 A0 ~ A12 VSS
OPEN VCC or GND
A0 ~ A12 VSS
w
VIL or VIH
(1MHz cycle)
VIL
q : Average operating current ICCA1 w : Average operating current ICCA2
Fig. 5 Current dissipation measurement circuit
Fig. 6 Standby current measurement circuit
4
Memory ICs
BR6265BF-N10SL
*Operating modes
Control pin OE X X H L X CE1 H X L L L CE2 X L H H H WE X X H H L Mode Wait state Wait state Output disabled Read Write I/O High impedance High impedance High impedance Data output Data output Power dissipation Standby state Standby state Operating state Operating state Operating state
X : Either VIL or VIH
to *AC test conditions: (Ta = 02.4V70C, VCC = 5V 10%) Input pulse level 0.8 to Input rise / fall time : 5ns I / O timing level : 1.5V Output load : 1 TTL gate and CL = 100pF
*Read cycle
Parameter Read cycle time Address access time CE1 access time CE2 access time OE access time Output hold time CE1 output set time CE2 output set time OE output reset time CE1 deselect output floating CE2 deselect output floating OE disable output floating Symbol tRC tAA tCO1 tCO2 tOE tOH tLZ1 tLZ2 tOLZ tHZ1 tHZ2 tOHZ Min. 100 -- -- -- -- 10 10 10 5 -- -- -- Max. -- 100 100 100 40 -- -- -- -- 35 35 35 Unit ns ns ns ns ns ns ns ns ns ns ns ns
5
Memory ICs
BR6265BF-N10SL
*Read cycle timing chart 1 (CE1 = OE = VIL, CE2 = WE = VIH)
tRC Address
tAA
tOH
Dout
Previous Valid Data
Valid Data
*Read cycle timing chart 2 (WE = VIH)
Address
Fig.7
tRC
tAA
CE1
tCO1
tHZ1
tLZ1
CE2 tCO2 tHZ2 tLZ2
OE tOHZ tOE
tOLZ
Dout High Impedance
Valid Data
Fgi.8
6
Memory ICs
BR6265BF-N10SL
*Write cycle
Parameter Write cycle time Chip select time Address valid time Address setup time Write pulse width WE output delay time CE1, CE2 output delay time WE * output floating time Input data set time Input data hold time WE * output set time Symbol tWC tCW tAW tAS tWP tWR tWR1 tWHZ tDW tDH tOW Min. 100 80 80 0 60 0 0 -- 40 0 5 Max. -- -- -- -- -- -- -- 35 -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns
*Write cycle timing chart 1 (WE control)
tWC Address tAW
tWR
OE
CE1
tCW
CE2
tCW
tAS
tWP
WE
tDW DIN tWHZ DOUT Valid Data
tDH
tOW
High Impedance
Fig.9
7
Memory ICs
BR6265BF-N10SL
*Write cycle timing chart 2 (CE1 control)
tWC Address
tAW OE
tAS tCW CE1
tWR1
CE2 tWP WE tDW tDH
DIN tWHZ tLZ1
Valid Data
DOUT
Fig.10
8
Memory ICs
BR6265BF-N10SL
*Write cycle timing chart 3 (CE2 control)
tWC Address
tAW OE
CE1 tAS tCW
tWR1
CE2 tWP WE tDW tDH
DIN
Valid Data tWHZ tLZ2
DOUT
Fig.11
While the I / O pin is in output state, input signals should not be applled which are in The contents noted in this document may fall under the jurisdiction of services
reverse phase to the output. pertaining to overseas exchange rates and overseas control regulations (services pertaining to design, construction, specifications), and may requlre special handiing.
9
Memory ICs
BR6265BF-N10SL
*Data retention characteristics at low power supply voltage (Ta = 0 to 70C): SL version products
Parameter Data retention power supply voltage Data retention current CS data retention time Operating recovery time Symbol VDR ICCDR tCDR tR Min. 2.0 -- 0 5 Typ. -- -- -- -- Max. 5.5 10 -- -- Unit V A ns ms Conditions CE1 VCC - 0.2V, CE2 or CE2 0.2V VCC - 0.2V CE1 VCC - 0.2V, CE2 VCC - 0.2V or CE2 0.2V, VCC = 3.0V -- --
1A (Max.), when Ta = 0 ~ 40C
*Data retention waveform at low power supply voltage
Data Retention Mode VCC 4.5V VDR tCDR tR 4.5V
CE1
CE1 2.2V
VDR - 0.2V 2.2V
Data Retention Mode
VCC 4.5V
VDR
4.5V
tCDR
tR
0.4V CE2 CE2 0.2V
0.4V
Fig.12
10
Memory ICs
BR6265BF-N10SL
*External dimensions (Units: mm)
18.0 0.2 28 11.8 0.3 8.4 0.2 15
2.55 0.10
1 0.20
14
1.27
0.40 0.10
0.5Min.
0.15 0.1
0.10
SOP-N28
11


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